Facilities
COSINC-CHR
The Characterization (CHR) facility within COSINC provides access and training on state-of-the-art instrumentation utilizing a wide range of materials characterization techniques, including Field-Emission Scanning Electron Microscopy (FE-SEM), conventional SEMs, Atomic Force Microscopy (AFM), Scanning Tunneling Microscopy (STM), Focused Ion Beam (FIB)-SEM and capabilities such as Energy Dispersive Spectroscopy (EDS) and Electron Backscatter Diffraction (ESBD). In addition, the lab includes a sample preparation room for users.
List of equipment that may be scheduled. Users will require a PPMS account to be able to reserve an instrument.ÌýSee details atÌýresource scheduler.
COSINC-CHR
JEOL JSM-7401FÌý
Cold field emission gun, magnification possible up to 200kx, two secondary electron detectors
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Scanning Electron Microscope
W-filement SEM with EDS and EBSD, variable pressure modes
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FEI Nova 600i Dual Beam
Dual beam system (Ga FIB + FESEM - thermal field emitter), Multiple gas injector system for deposition (Pt and SiO2), pc-controlled nm resolution manipulator, TEM sample preparation
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Nanosurf DriveAFM
Tip-scanning, scan field sizes up to 90 µm, electrical/magnetic/mechanical properties measurements, STM capability
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Leica DM2700 Upright Materials Microscope
Transmission/refecting modes, white light LED illumination, bright field and dark field observation
Leica EM ACE600
Sputtering with TMP vacuum (Au and Pt targets available), carbon thread evaporation, only for EM applications
Leica EM CPD300
Drying delicate samples for SEM applications and preserve the surface structure of specimen
Rigaku SmartLab 9kW
Provides a variety of parameters including phase identification, lattice parameter, crystallite size, strain, and texture quantification, electron density and layer thickness quantification, and epitaxial quality for a variety of bulk or thin film samples. X-ray diffractometer has both Cu and Mo Ka targets. Supports transmission and reflection measurements including powder diffraction, thin film diffraction, X-ray reflectivity, rocking curve, and GI-WAXS. Air-free sample holders are available.
Iontof QTac100 High Sensitivity LEIS system
Provides the elemental composition of the outer atomic layer of surfaces. Includes small spot analysis, surface imaging, static and dynamic depth profiling.
Kratos Axis Supra XPS Surface Analysis System
Surface sensitive technique to analyze composition of sample and chemical shift information within the first 10 nm. Equipped with monochromated X-ray gun (Al and Ag anodes) and UV Photelectron Spectroscopy (UPS) He lamp. Equipped with Gas cluster ion source (GCIS, Mininbeam 6), operates in both Arn+ cluster and Ar+ monatomic modes, suitable for sputter cleaning, depth profiling organic, inorganic and metallic films
PIE Scientific Tergeo-PlusÌý
Automatic plasma cleaner with quartz chamber, enhanced chemical resistance and reduction of alkali impurities
Surface sensitive technique to analyze composition of sample and chemical shift information within the first 10 nm. Equipped with monochromated X-ray gun (Al and Ag anodes) and UV Photelectron Spectroscopy (UPS) He lamp. Equipped with Gas cluster ion source (GCIS, Mininbeam 6), operates in both Arn+ cluster and Ar+ monatomic modes, suitable for sputter cleaning, depth profiling organic, inorganic and metallic films
Cressington 108 Auto/SE Sputter
Pt target available, only for EM applications
Leica S9 series Greenough
9:1 zoom with magnification 6.1x-55x, 10x, field of view of up to 37.6 mm
Bruker DektakXTA
Measurements repeatability of 0.4 nm for step heights measurements
Shimadzu UV3600i with MPC-603A
Multi-purpose large-sample compartment, refelctance and transmittance measurements at several angles, from 190 nm to 3200 nm
COSINC-FAB Clean Room
The Fabrication (FAB) cleanroom facility, within COSINC provides access and training on various state-of-the-art instrumentation in lithography, mask-making, thin-film deposition, thermal and wet processing and etch systems. The lab accommodates a wide variety of fabrication projects and sample materials for applications in areas ranging from electronics, optics, material science to chemistry and medicine.
List of equipment that may be scheduled. Users will require a PPMS account to be able to reserve an instrument (see details underÌýresource scheduler).
Lithography
| This tool is slated to be replaced in 2026 by the Raith Picomaster XF200 direct writer.Ìý The Heidelberg DWL 66FS is a high-resolution, direct-write lithography system designed for rapid prototyping and advanced microfabrication. It eliminates the need for photomasks by using a focused laser beam to expose photoresist directly, enabling fast iteration and custom patterning with sub-micron precision. |
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| Nanoscribe's Photonic Professional GT2 uses Two-Photon Polymerization (2PP) to produce filigree structures of nearly any 3D shape by high-precision 3D printing: crystal lattices, porous scaffolds, naturally inspired patterns, smooth contours, sharp edges, undercuts and bridges are all manufacturable with high resolution. More than a thousand successful research projects by Nanoscribe customers and system users are evidence of the power of two-photon lithography. Tool Specifications:Ìý - Printing technology:ÌýÌýÌý Layer-by-layer Two-Photon Polymerization - Minimum XY feature size:ÌýÌýÌý 160 nm typical; 200 nm specified* - Finest XY resolution:ÌýÌýÌý 400 nm typical; 500 nm specified* - Finest vertical resolution:ÌýÌýÌý 1,000 nm typical; 1,500 nm specified* - Layer distance:ÌýÌýÌý variable, 0.1 – 5.0 µm* - Maximum object height:ÌýÌýÌý 8 mm* - Build volume:ÌýÌýÌý 100 × 100 × 8 mm³ * - Minimum surface roughness Ra:ÌýÌýÌý ≤ 20 nm* - Max. scan speed:ÌýÌýÌý from 100 to 625 mm/s* * Values may vary depending on the Solution Set, objective or photo resin in use Location: Bay 4 Affiliation: COSINC |
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| The OAI 806 Mask Aligner is a precision photolithography tool for patterning substrates up to 6 inches. It supports soft, hard, and proximity contact modes with submicron alignment accuracy. Designed for research and prototyping, it features a collimated UV light source, vacuum chuck, and intuitive controls for consistent, high-resolution exposures. Integrated microscope optics and motorized stage enable precise alignment for single- and multi-layer processes. Optional backside alignment expands its versatility for advanced microfabrication. Reliable and user-friendly, the OAI 806 is ideal for fabricating semiconductors, MEMS, and photonic devices. Location: Bay 4 Affiliation: NQN Grant |
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| The Raith EBPG is a high-resolution electron beam lithography system designed for advanced nanofabrication. It offers sub-10 nm patterning precision across large write fields, ideal for complex device prototyping and mask creation. With full vector scan capability and automated stage control, it supports high-throughput, multi-layer exposures. Our facility includes Beamer software for streamlined data preparation, dose correction, and proximity effect compensation. The EBPG is optimized for demanding applications in quantum devices, photonics, and nanoelectronics, providing unmatched flexibility and accuracy for researchers pushing the limits of nanoscale design. Location: Bay 3 Affiliation: COSINC |
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| ComingÌý 2026 The Raith PICOMASTER XF200 is a high-speed laser lithography system for direct-write patterning on photomasks and wafers. It delivers sub-micron resolution with full vector scanning and rapid exposure across large areas. Ideal for micro-optics, photonic structures, and mask fabrication, it supports grayscale lithography and multi-level patterning. The XF200 combines precision, speed, and flexibility—enabling researchers to prototype complex designs with high fidelity and minimal turnaround. Location: TBD Affiliation: NQN Grant |
| ComingÌý 2026 The YES HMDS Vapor Prime system enhances photoresist adhesion by applying hexamethyldisilazane (HMDS) via vapor priming. It treats up to 6-inch wafers with uniform surface conditioning, improving lithography results and reducing resist lift-off. The automated process ensures consistent priming across batches. Location: TBD Affiliation: NQN Grant |
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Thin Film Deposite
| The Angstrom Engineering system supports both electron beam evaporation and dual-head sputtering for versatile thin film deposition. It features high-vacuum e-beam sources for precise material control and two sputter heads with RF, DC, and pulsed DC capabilities—ideal for metals, dielectrics, and complex multilayers. This flexible platform enables high-quality coatings for optics, electronics, and nanodevices with fine control over thickness, uniformity, and composition. Tool Specifications:Ìý - 6x7cc pocket e-beam evaporator with a 6 kW (10 kV - 600 mA) solid state power supply.Ìý - Programmable sweep pattern and rate control.Ìý - Two 3-inch sputter targets.Ìý - 1.0 kW solid state pulsed DC power supply capable of running in DC or pulsed DC mode, 0 - 100 kHz pulse frequency, 0 - 800 V | 0 - 2.5 A.Ìý - 600 W RF Power Supply and Matching Network, 13.56 MHz power supply with automatic matching network. - Rotating substrate stage with temperature control from ambient to 600C, height control, and up to 100 W RF bias Location: Bay 2 Affiliation: COSINC |
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| ComingÌý 2026 The Angstrom Engineering EvoVac is a versatile thermal evaporator designed for high-quality thin film deposition. It features two thermal sources and two Radak II electron beam sources, enabling precise control over a wide range of materials. With high-vacuum operation and programmable deposition parameters, the EvoVac supports multilayer stacks, co-deposition, and uniform coatings for optics, electronics, and nanofabrication. Its flexible configuration makes it ideal for research. Location: TBD Affiliation: NQN Grant |
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| The Beneq TFS 200 is a versatile atomic layer deposition (ALD) system optimized for thermal processes. It delivers precise, conformal coatings of aluminum, titanium, and tin oxides on wafers and 3D substrates. With nanometer-scale thickness control and uniformity, it supports high-quality films for electronics, optics, and barrier layers.Ìý Tool Specifications:Ìý Precursors include Trimethylaluminum (TMA), Water, Titanium tetrachloride (TTC), Diethylzinc (DEZ), (Tetrakis)dimethylamido tin (IV) (TDMA-Sn), and Oxygen/Ozone Location: Bay 2 Affiliation: COSINC |
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| This tool is slated to be replaced in 2026 by the Angstrom Engineering thermal evaporator.Ìý The CVC Thermal Evaporator is a reliable thin film deposition system designed for metals and dielectrics. It uses resistive heating to evaporate materials from thermal sources under high vacuum, enabling uniform coatings with precise thickness control. Ideal for single-layer films and simple stacks, it supports up to 4-inch substrates. Location: Bay 2 Affiliation: COSINC |
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Dry Etch
| This tool is slated to be replaced in 2026 by theYES CV200RFS downstream asher.Ìý The March Jupiter III is a parallel-plate reactive ion etcher (RIE) designed for precise photoresist removal and surface cleaning. It uses direct RF plasma exposure to uniformly strip organic materials from substrates up to 4 inches. With recipe-driven control and consistent batch processing, it supports post-lithography descum and ashing steps in cleanroom workflows requiring repeatable, high-throughput performance Tool Specifications:Ìý - 300 Watt, 13.56 MHz - Pressures typically ranging from 100-500 mT.Ìý - Chamber has a 5 inch diameter lower electrode that can accommodate wafer pieces and full wafers up to 4 inches. Location: Bay 4 Affiliation: COSINC |
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| The Plasma-Therm Apex ICP is a chlorine-based inductively coupled plasma etcher configured for precise, anisotropic etching of chalcogenide materials. Designed for substrates up to 4 inches,Ìý pieces can also be mounted on carrier wafers for flexible sample handling. It features independent RF bias and ICP power control for fine-tuned ion energy and density. Tool Specifications:Ìý - Plumbed with Cl2, BCl3, O2, CHF3, Ar, N2.Ìý - This tool is currently restricted to III-V materials.Ìý - Mechanical clamp accepts 4 inch wafers, smaller wafers or wafer pieces can be mounted to 4 inch carrier wafers.Ìý - He backside cooling is available.ÌýÌý - ICP generator: 2000 W at 2 MHz - RF generator: 600 W at 13.56 MHz - Platen temperature 20C to 40C - Chamber Temp 20c to 100C Location: Bay 1 Affiliation: COSINC |
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| ComingÌý 2026 The Plasma-Therm Corial 210IL is a deep reactive ion etching (DRIE) system designed for high-aspect-ratio silicon etching. It uses inductively coupled plasma (ICP) with alternating passivation and etch cycles to achieve vertical profiles with excellent selectivity and sidewall control. Location: TBD Affiliation: NQN Grant |
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| The Plasma-Therm Vision 320 is a reactive ion etching (RIE) system designed for anisotropic etching of materials such as silicon and oxides. It uses parallel-plate RF plasma with precise control over gas flow, pressure, and power to achieve uniform etch profiles. The system is plumbed for fluorine-based chemistries, including CFâ‚„, SF₆, and CHF₃. Its large platen accommodates multiple samples simultaneously and supports large substrates up to 8 inches, as well as smaller wafers and pieces. Tool Specifications:Ìý -Ìý Plumbed with CF4, CHF3, SF6, O2, N2 - 12 inch diameter platen can accommodate full wafers or wafer pieces, maximum wafer size 280 mm. - 600 watt, 13.56 MHz, RF plasma - Temperature control of lower electrode between 5 and 40 C ± 3 C.Ìý - Optical emission endpoint etch monitoring for endpoint detection and allowing automated process control of target etch depth repeatable to < ± 2% (run-to-run) Location: Bay 1 Affiliation: COSINC |
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| ComingÌý 2026 The YES CV200RFS is a downstream plasma asher designed for gentle, uniform removal of photoresist and organic residues. It generates plasma remotely, allowing only neutral radicals to reach the substrate—ideal for damage-sensitive materials and delicate structures.Ìý Location: TBD Affiliation: NQN Grant |
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Meterology
| The Filmetrics F40-UV is a non-contact thin-film measurement system designed for precise thickness and refractive index characterization. It uses spectroscopic reflectometry in the UV-visible range to analyze transparent and semi-transparent films on reflective substrates. Mounted on a microscope, the F40-UV enables spot measurements with micrometer-scale spatial resolution—ideal for patterned samples, small features, and localized film mapping. Location: Bay 4 Affiliation: COSINC |
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| ComingÌý 2026 The J.A. Woollam M-2000 is a spectroscopic ellipsometer designed for precise characterization of thin films. It measures thickness, refractive index, and extinction coefficient across a broad spectral range—from UV to near-infrared—using rotating compensator technology for high-speed, high-accuracy data acquisition, making it ideal for complex multilayer stacks, transparent films, and advanced material research. Location: TBD Affiliation: NQN |
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| The Keyence VHX-7100 is a high-resolution digital microscope designed for advanced imaging and analysis of microstructures. It offers variable magnification with real-time depth composition, enabling fully focused 3D-like images across uneven surfaces. Configured for samples up to 4 inches, it includes a lithography inspection filter and height measurement capabilities. The system supports both 2D and 3D image stitching for wide-area visualization, and features a tilting head for off-axis observation of complex topographies. Location: Bay 4 Affiliation: NQN Grant |
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| The KLA Tencor P7 is a stylus profilometer designed for high-resolution surface topography and step height measurements. It uses a contact-based stylus to scan across the sample, capturing vertical features with sub-nanometer precision. The system includes a fully motorized stage for automated scanning and measurement routines, and offers film stress and wafer bow analysis for comprehensive thin-film characterization Location: Bay 3 Affiliation: NQN Grant |
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| The Sensofar S neox is a high-resolution optical profilometer designed for non-contact 3D surface metrology. It integrates multiple measurement modes—including Confocal Microscopy, Focus Variation, Coherence Scanning Interferometry (CSI), Phase Shifting Interferometry (PSI), and Enhanced PSI (ePSI)—to characterize surface roughness, texture, and topography across a wide range of materials. The system features selectable RGB LED illumination for optimized contrast and material-specific imaging, along with automated stage control and sub-nanometer vertical resolution. Location: Bay 3 Affiliation: NQN Grant |
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Wet Processing
| The Torrey Pines HS60 and HS60A are programmable digital hot plates with integrated magnetic stirring, designed for precise heating and mixing in cleanroom and laboratory environments. They feature a chemically resistant 6" × 6" top plate (ceramic or aluminum respectively), with temperature control up to 450 °C and ±1% accuracy. The systems supports multi-step programmable profiles, repeatable ramp/hold cycles, and external probe feedback for solution-based temperature control. Ideal for resist baking, solution heating, and uniform mixing during sample preparation and wet processing. Location: Bay 1 & 4 Affiliation: COSINC |
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| Stainless steel solvent benches are used for sample preparation, cleaning, and lithography processing in cleanroom environments. They provide ventilated, chemical-resistant work surfaces with integrated exhaust systems to safely handle solvents and volatile chemicals. Benches are equipped with Nâ‚‚ guns, a sonicator, spin coaters, and hot plates to support a wide range of wet processing tasks including resist coating, development, and substrate cleaning. Location: Bay 4 Affiliation: COSINC |
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| The WS-650MZ-23NPPB from Laurell Technologies is a versatile spin coating system widely used in microfabrication, photolithography, and polymer film processing. It supports a broad range of substrates and offers fine-grained control over spin parameters for consistent, uniform coatings. Tool Specifications:Ìý - 2 coaters: one dedicated to e-beam resists and one for general use - 100-6000 rpms are capable with multi step programming - Solvent spinning is not allowed Location: Bay 4 Affiliation: COSINC |
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| Plastic wet benches are used for acid and base etching processes in cleanroom environments. Constructed from chemically resistant materials such as polypropylene, they provide safe, ventilated workspaces for handling aggressive chemicals like HCl and Hâ‚‚SOâ‚„. These benches include integrated exhaust systems, DI water taps, and spill containment features, supporting a range of wet etch tasks with enhanced safety and contamination control. Location: Bay 1 Affiliation: COSINC |
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